polishing wafer

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polishing wafer

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polished wafer Specifications


Thickness(μm) TTV(μm)TIR(μm)BOW(μm)WARP(μm)LLS(ea)
FZ-Si-polished waferSingle side polished wafer150-1500≤5≤5≤20≤20<10@0.3μm
Double sides polished wafer150-1500≤5≤5≤20≤20<10@0.3μm
 CZ-Si-polished
wafer
Single side polished wafer150-1500≤5≤5≤20≤20<10@0.3μm
Double sides polished wafer150-1500≤5≤5≤20≤20<10@0.3μm

Note:If customer has any special requirements on geometrical parameters, we can process accordingly.

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